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SK hynix Hi-5021Q 50MP 0.70μm Pixel CMOS Image Sensor Device Essentials Plus
The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.
Deep Dive Teardown of the Xiaomi Redimi K70 Pro 23117RK66C Smartphone
Both smartphones also have the same battery charging design with the only exception that Xiaomi 14 Pro has Wireless charging capabilities. It is also similar to the Xiaomi Redmi Note 13 Pro’s design with a difference in which main SoC (SC8551A) was used.
Deep Dive Teardown of the Fitbit Charge 6 G3MP5 Activity Tracker
The Fitbit Charge 6 G3MP5 is the latest activity tracker from Fitbit Inc. and an improved successor to the Fitbit Charge 5 FB421. The Charge 6 has a 1.04” OLED Display. In both devices, the Display/Touchscreen Subsystem is made by Truly Opto-electronics and has the same part number. The Display Panel and touchscreen Module are separated in this subsystem.
Exploring Tesla's Full Self-Driving
Embark on a journey with TechInsights as we explore the world of Tesla's advanced Full Self-Driving (FSD) driving capabilities.
Ned May
Ned May Director, End Market Analysis Ned leads End Market Analysis at TechInsights which includes our coverage of Automotive, Mobile, Consumer Electronics and Telecom Strategies. He brings over 25 years of experience as both an advisor to and
Unlocking Insights: SoC Design Analysis Q1 2024 Briefing
This briefing features key innovations in the latest new technologies: TSMC 3 nm and Intel 4 nm, and the disruptive SMIC 7 nm N+2, through the lens of digital gates and standard cell libraries. Discover our latest benchmarking on scaling and transistor density metrics of leading flagship SoCs like the Apple A17, HiSilicon Kirin 9010, and MediaTek Dimensity 9200.
Samsung K9DYGY8J5B-CCK0 236L 1Tb 3D NAND Internal Waveform Analysis
The Samsung 1 Tb 236L triple-level-cell (TLC) 3D NAND flash memory device (die markings: K9AKGD8J0B) is one of 16 dies packaged inside one Samsung K9DYGY8J5B-CCK0 NAND flash memory package, which was found in the MZ-V9P4T0 990 Pro PCIe 4.0 NVMe M.2 4 TB solid state drive (SSD).
HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra
HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra Discover the groundbreaking technology behind Huawei's Pura 70 Ultra smartphone, powered by the innovative HiSilicon Kirin 9010 processor. Delve into our in-depth analysis by the TechInsights team
Sony LYTIA LYT900 50MP 1.6μm Pixel ISP Die Standard Floorplan Analysis
The Sony LYTIA LYT900 is a rear wide-angle camera module that was extracted from the Oppo Find X7 Ultra (PHY110) smartphone. The camera module measures 27.96 mm × 31.16 mm × 10.68 mm thick. It contains a stacked imager comprising a CIS die and an ISP die. This floorplan analysis (FAR) examines the ISP die.
Value Share: Global Smartphone Vendor ASP and Revenue Share by region: Q4 2023
Global smartphone industry revenues grew by 8% in Q4 2023. Apple, Samsung and Xiaomi were the top three vendors and together accounted for 3/4th of the global revenues. Apple was the leading vendor by revenues in all of the six regions tracked.
Forecast: Global 5G Smartphones by Technology up to 2029
We expect mmWave technology to reach 11% penetration of all 5G smartphones in 2023. The majority of sales volumes come from the North American market.
Deep Dive Teardown of the Huawei Eyewear 2 LFT-G00 Smart Glasses
The Huawei Eyewear 2 LFT-G00 are smart glasses that include two speakers in the temples to create a comfortable open-ear audio listening experience without the need for earpieces. It features the WUQI microelectronics WQ7036AX Bluetooth 5.3/Audio SoC with memory.
Efficient Power Conversion EPC2619 100V 3.3mOhm Gen 6 GaN Transistor Power Essentials
The Efficient Power Conversion EPC2619 device includes a single gallium nitride (GaN) power high electron mobility transistor (HEMTs) die with a continuous rating voltage of 100 V, the power GaN transistors operate in enhancement mode (normally-off) and exhibit a typical 3.3 mΩ on-resistance (RDS(ON)) at 5 V VGS bias.
Apple Watch Series 9 (S9 SiP) Digital Floorplan Analysis
The Apple TMQW67 die, examined in this digital floorplan analysis (DFR), was found inside the Apple S9 module. The Apple S9 system-in-package (SiP) module was extracted from the Apple Watch Series 9 GPS+Cellular (A2984).
Can AI Microprocessors be Sustainable? New NVIDIA Blackwell Chip Points to a Breakthrough for High Tech Industry
TechInsights’ sustainability tools provide a clearer view of the NVIDIA Blackwell platform’s sustainability, including cradle-to-gate carbon footprint and power consumption, compared to its predecessors.
Micron D1β LPDDR5X DRAM Process Full Flow Analysis
A Synopsys 3D-emulation analysis of the process flow and integration used in the manufacture of the Micron Technology MT62F1G64D4AM-031_XT_C (Y52P die), built in Micron’s D1b nm technology. The emulation includes SPX input files that can be used as input into other Synopsys models.
STMicroelectronics Ouster OS1 LiDAR SPAD Array Sensor – L3 Chip Process Flow Analysis
The STMicroelectronics Ouster L3 Chip with 10 µm pixel pitch is the third-generation LIDAR chip. It is a stacked back-illuminated direct Time-of-Flight (d-ToF) SPAD sensor, which competes directly with the SONY IMX459. The L3 SPAD chip has many innovations, including hybrid bonding, in die quench resistor, dual DTI pixel isolation, finger capacitor, and diffraction grating.
OmniVision OV50K 50MP 1.2μm Pixel PureCel Plus-S CMOS Image Sensor Device Essentials Folder
The OmniVision OV50K CMOS image sensor (CIS) was extracted from the Honor Magic 6 Pro smartphone (BVL-AN16). The OmniVision OV50K is a Quad Bayer color, 50 MP, stacked back-illuminated (BI) electronic rolling shutter CIS utilizing the PureCel Plus-S technology for mobile cameras. This device essentials (DEF) report examines both the CIS and image signal processor (ISP) die.