Latest Blogs and Commentary
Apple iPad Pro 13" A2926 Deep Dive Teardown
Apple iPad Pro 13" is Apple's thinnest product ever at 5.1mm. It is available for both Wi-Fi/Cellular connectivity. It is designed with the new Apple M4 chip APL1206 Application Processor and Qualcomm SDX70M Baseband Processor, 13" XDR display 2752x2064 pixels, front and rear 12MP cameras.
Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed
Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.
The Chip Insider®– If Trump wins election: The bill for Chip Makers
In this blog, we discuss the potential impact on the semiconductor industry if Trump wins the election, including concerns about U.S. direct investment requirements for foreign chip makers, and Samsung's delay of their Taylor, TX fab following the $6.4 billion CHIPS Act subsidy announcement.
Intel Drops Hyperthreading From New CPU
Intel’s Lion Cove contains significant departures from previous CPU microarchitectures, prioritizing performance efficiency by omitting hyperthreading and other performance-boosting innovations but still manages to deliver a double-digit IPC uplift.
Microprocessor Report June 2024 Review
Microsoft’s Copilot+ PC demands saw Qualcomm, Intel and AMD all launch new PC SoCs with advanced NPUs. Intel’s Gaudi 3 will compete with NVIDIA—although only NVIDIA’s previous generation H100. Advanced packaging is a significant industry trend, and AR is a driving force behind new packaging technologies from TSMC seen in the Apple R1, and an experimental SoC from Meta.
Samsung Exynos W1000 Wearable Processor Samsung SF3 GAA Process – Release 1
This report provides a preliminary analysis of the structure and materials used in the manufacture of of the Samsung Exynos W1000 wearable processor die, fabricated using the SF3 process, Samsung’s second-generation (gate-all-around) GAA process.
AI's Influence on Advanced Packaging: Mid-Year Briefing Highlights and Innovations
Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.
HP Omen 16 (2023) (7N9X4UA_ABA) Deep Dive Teardown
HP Omen 16 2023 laptop is released specially for gaming applications, powered by AMD Rayzen 7840H processor and NVIDIA GeForce RTX 40 series graphics processor. Laptop designed with Wi-Fi 6e/Bluetooth 5.3 and 2TB PCIe Gen 4 Samsung SSD.
Canon 3.2 MP Stacked SPAD Image Sensor Device Essentials Plus
This report provides a detailed analysis into the structure of the Canon LBC010 SPAD die. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.
Apple Vision Pro: Revolutionizing Face ID with TrueDepth Technology
Spatial computing integrates a user’s virtual environment with their physical surroundings, and Apple's Vision Pro achieves this with a suite of advanced sensors. While LiDAR, or Light Detection and Ranging, plays a significant role in mapping the user's space, the TrueDepth camera system adds another layer of depth sensing.
Galaxycore GC32E1 Device Essentials Plus
This report provides an extended insight into the structure of the Galaxycore GC32E1 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor, including a summary of the salient features observed, and accompanied by a set of optical, SEM cross-section, and bevel images of the CIS die.
Exploring the New Samsung Galaxy Watch 7 Ultra: Unboxing
Explore the new Samsung Galaxy Watch 7 Ultra with TechInsights as we unbox and analyze the powerful Exynos W1000 processor. Join us as we uncover the latest in wearable technology and delve into the innovations driving Samsung's newest smartwatches.
Samsung Galaxy Watch 7
Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.
Samsung Exynos W1000 Processor
Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.
Component Price Landscape Q2 2024
In 2024, semiconductor sales started experiencing robust growth. The total market for semiconductors grew by 24% in the first half (1H) of 2024 and is expected to continue surging in the second half (2H) at a rate of 29%.
Shaoqing Wu
Shaoqing Wu Senior Circuit Analyst Shaoqing Wu is a senior circuit analyst at Techinsights where she provides circuit analysis and technical support for Intellectual Property and competitive intelligence. She has 25 years of professional experience
Sustainability at SEMICON West 2024: Achieving Sustainable Growth in the Semiconductor Industry
SEMICON West recently wrapped up, and one of the notable programs focused on sustainability, which provided a platform for sharing insights, innovative solutions, and collaborative strategies to address environmental challenges.
July McClean Report
The July Update to the McClean Report reviews semiconductor industry capital spending and capacity. Semiconductor fabrication is an exceptionally capital-intensive process.