Product Code
FAR-1712-903
Availability
Published
Product Item Code
APP-S3
Device Manufacturer
Apple
Device Type
System in Package (SiP)
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Apple W2 338S00348 Bluetooth Module Basic Functional Analysis
This report presents a Basic Functional Analysis of the Apple W2 338S00348 die found inside the Apple 338S00348 W2 chip.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to polysilicon
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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