Latest Blogs and Commentary
Apple iPad Pro Teardown
In this year’s iPad Pro, the new 12.9” mini-LED display and new TrueDepth camera system may be taking ‘Center Stage’ for many users, TechInsights will continue to look deeper for other semiconductor and design winners inside the new iPad Pro.
Groundbreaking SenSWIR Sensor by Sony- IMX990/IMX991
This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.
Apple Homepod Mini Teardown
May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four
Intel's 2nd Generation XPoint Memory
April 30, 2021 Dr. Jeongdong Choe Intel's 2 nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1 st gen. XPoint Memory (Optane TM Memory 16GB, MEMPEK1W016GA) including structure
Qualcomm extends their mmWave leadership position
April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of
Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) - Memory Blog
April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in
World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin
March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1
KIOXIA’s new XL-FLASH for ultra-low latency NAND application
March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high
Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog
Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture
Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies
March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive
A New and advanced ReRAM from Fujitsu
March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The
GaN USB-C Charger Market Heating Up in 2021
March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights
Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary
March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on
LiDAR 101 – Solid-State and Mechanical LiDARs
February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster
Samsung 12Gb D1z LPDDR5 with EUV Lithography Applied
February 17, 2021 NAND & DRAM Memory Technology Download the brief Samsung 12Gb D1z LPDDR5 with EUV Lithography Applied After months of waiting, we have seen Samsung Electronics’ applied Extreme Ultraviolet (EUV) lithography technology for D1z DRAM
三星EUV微影製程D1z記憶體揭密
March 15, 2021 Jeongdong Choe，TechInsights 三星EUV微影製程D1z記憶體揭密 經過幾個⽉的漫⻑等待之後，三星電⼦(Samsung Electronics)採⽤極紫外光(EUV)微影製 程的D1z DRAM終於量產了！ 三星電⼦在今年稍早發表了號稱業界⾸創，同時分別採⽤氟化氬浸潤式微影(ArF-i)製程與 EUV微影技術的D1z DRAM，⽽TechInsights很興奮地宣佈，我們針對三星最新/最先進 D1z DRAM的拆解分析有⼀些「新發現」
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