This report presents a Process Node Assessment of the RFMD M1D150010 die found inside RFMD RF1500 package. The RF1500 is a 24-pin land grid array (LGA) multichip package comprising two dies, the M1D150010 antenna switch and the M2D1496A03B integrated passive device (IPD). The IPD is flip-chip attached to the printed wiring board (PWB) and the antenna die is mounted on the back of the IPD and wire bond connected to the PWB.