Qualcomm SDM845 Application Processor Samsung 10LPP FinFET Process Digital Functional Analysis

Product Code

FAR-1803-801

Release Date

30/05/2018

Availability

Published

Product Item Code

QUA-SDM845

Device Manufacturer

Qualcomm

Device Type

Applications Processor

Subscription

Compute

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Qualcomm SDM845 Application Processor Samsung 10LPP FinFET Process Digital Functional Analysis

This report presents a Digital Functional Analysis of the Qualcomm HG11-P7872-2 die found inside the Qualcomm SDM845 package-on-package (PoP) component. The SDM845 was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965U.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI, gate, contacts and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the ICWorks Browser

Related Analysis	Manufacturer	Analysis Type	Subscription Channel
Qualcomm Snapdragon 888 A78 CPU SoC Design Analysis	Qualcomm	Process	Logic - SoC Design Analysis, Logic - SoC Design Analysis (IP)
Qualcomm SM8350 Snapdragon 888 Samsung 5 nm LPE CPU (X1) SoC Design Analysis	Qualcomm	Process	Logic - SoC Design Analysis, Logic - SoC Design Analysis (IP)
Ambarella CV22 SoC Digital Floorplan Analysis	Ambarella	Floorplan	Logic - Digital Floorplan, Logic - Digital Floorplan (IP)
NVIDIA Ampere GA100 7 nm GPU Digital Floorplan Analysis	nVIDIA	Floorplan	Logic - Digital Floorplan, Logic - Digital Floorplan (IP)
Broadcom BCM56880 Trident 4 TSMC N7HPC Process Digital Floorplan Analysis	Broadcom	Floorplan	Logic - Digital Floorplan, Logic - Digital Floorplan (IP)
Intel Xe GPU DG1 Digital Floorplan Analysis	Intel	Floorplan	Logic - Digital Floorplan, Logic - Digital Floorplan (IP)
Samsung Exynos 2100 5 nm FinFET Process Digital Floorplan Analysis	Samsung	Floorplan	Logic - Digital Floorplan, Logic - Digital Floorplan (IP)
AMD Ryzen 9 5950X TSMC N7 HPC FinFET Process Digital Floorplan Analysis	AMD	Floorplan	Logic - Digital Floorplan, Logic - Digital Floorplan (IP)
Qualcomm Snapdragon 888 Samsung 5LPE Process aCMOS Essentials	Qualcomm	Process	Logic - Process, Logic - Process (IP)
NVIDIA Ampere GA102 GPU Samsung 8N FinFET Process Digital Floorplan Analysis	nVIDIA	Floorplan	Logic - Digital Floorplan (IP), Logic - Digital Floorplan