Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Packaging has become more sophisticated and a differentiator in the overall performance of advanced SoC chipsets. It can significantly impact form factor, helping to miniaturize designs in the multichip package and improve chip-chip RC delay. The Ultra is the first example of a device utilizing InFO-L technology that TechInsights has documented.

Semiconductor sales dipped 6% below 2021 levels last week, as the IC weather cooled 1˚F to Chilly conditions. Zooming in on DRAMs this week, the 13-wk growth MA dropped to -13% Y/Y, falling off last year’s peak of +54% in October.

In this eBook, TechInsights brings you our first analyses of two innovative SiC FETs whose electrical characteristics are assessed with results presented under identical condition. Using a comprehensive array of test conditions and add extra valuable information, we delve into their robustness under stress and go well beyond the datasheet.

This on-demand podcast brings together Bloomberg Senior Hardware Analyst Woo Jin Ho and TechInsights’ Forecasting Analyst, Taylor St. Germain for an in-depth discussion about the state of the semiconductor supply chain.

TechInsights has just received the Motorola Moto X30 Pro (XT2241-1) smartphone and launched an analysis on its wide-angle rear camera, confirming the Samsung HP1.

Temperatures are cooling amid rising uncertainty Andrea Lati Order activity for semiconductor equipment slipped to 82 degrees The weakness in Memory and Subcon/Adv. Packaging continued to weigh on the overall activity The memory market is now in the midst of a downturn due to a significant supply

In the data-center accelerator race, the three-year-old startup has burst from the gate with a chiplet-based design that aims to compete with Nvidia for general-purpose-GPU (GPGPU) cloud computing.

The startup has made progress on its Grai VIP deep-learning accelerator, changing native processing from INT8 to FP16 and adding audio workloads to its target applications.

Meteor Lake will introduce a multidie arrangement using Intel’s silicon-substrate and advanced packaging technologies. This chiplet approach will appear across all PC price tiers beginning late next year.