Govt Tech Controls & Chip Slowdown

Govt Tech Controls & Chip Slowdown G. Dan Hutcheson The Chip Insider® The Greater Geopolitical Messaging of U.S Government Technology Controls: A few weeks ago the U.S. Government put Export Controls on EDA and Wide Bandgap Substrates. Then they blocked Nvidia & AMD from selling advanced AI chips in
09Sep

Apple M1 Ultra Advanced Packaging

Packaging has become more sophisticated and a differentiator in the overall performance of advanced SoC chipsets. It can significantly impact form factor, helping to miniaturize designs in the multichip package and improve chip-chip RC delay. The Ultra is the first example of a device utilizing InFO-L technology that TechInsights has documented.
08Sep

Temperatures are cooling amid rising uncertainty

Temperatures are cooling amid rising uncertainty Andrea Lati Order activity for semiconductor equipment slipped to 82 degrees The weakness in Memory and Subcon/Adv. Packaging continued to weigh on the overall activity The memory market is now in the midst of a downturn due to a significant supply
06Sep

Biren GPGPU Aims for the Clouds

In the data-center accelerator race, the three-year-old startup has burst from the gate with a chiplet-based design that aims to compete with Nvidia for general-purpose-GPU (GPGPU) cloud computing.
06Sep