Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.

CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.

Apple’s annual big reveal in September 2022 promised an iPhone 14 with “a re-engineered proximity sensor”, detecting light from behind the display to save additional space. This is the type of announcement the CIS subscription likes to hear about, and indeed our initial teardown analysis showed that Apple decided to change their approach to the proximity sensor.

TechInsights' Semiconductor Analytics report

The innovation seen within smartphones, including increasingly faster charging speed, has been exciting to watch over the past year. Key players like Xiaomi, Realme, Samsung, and Black Shark are leading the pack in this space with Xiaomi and Realme as the top competitors, surpassing 100 W.

The memory technology landscape is continuously evolving. DRAM and NAND Flash memory demands have been steadily increasing and emerging memory markets such as STT-MRAM, ReRAM, PCRAM, FeRAM, and 3D XPoint memory are expected to reach $36 billion by 2030. As emerging memory makers race ahead of device scaling, they will face several challenges.

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Andes has a new high-end CPU that handles the longest vectors yet for RISC-V as well as a new small entry-level CPU for small connected systems.

The Sapphire Rapids Xeon Scalable processor integrates multiple features that Intel disables in certain models. The company’s On Demand program allows customers to enable them postpurchase.