The Supermicro server contains two Intel Xeon Sapphire Rapids processors. It has a mechanical structure typical of professional servers in this class.

The Honor X50 was supplied for the first time by Qualcomm octa-core Snapdragon 6 Gen 1 processor SM6450-500-AB with package size 12.54 × 12.04 mm while the die size was 8.05 × 6.65 mm.

The global automotive landscape is transforming as the push for sustainability grows. Governments and consumers are driving the shift to electric vehicles (EVs), with countries like the EU, U.S., and China leading the way.

Cadence’s Neo AI licensable IP block provides up to 80 TOPS of performance. Its NeuroWeave SDK unifies AI design across all Cadence IP options.

Accelerated AI is a key feature of Intel’s forthcoming Core Ultra (Meteor Lake) processors.

Peak raw performance of the Hexagon-based AI accelerator in Qualcomm’s newest flagship smartphone processor is 4× greater than that of the previous generation.

Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level Share This Post On September 20, Amazon hosted its annual devices and services event that evolved at a notably slower pace, and with fewer new product announcements than in the past. The underlying message at this event was how

TechInsights' Semiconductor Analytics Report

This is a Memory Floorplan Analysis (MFR) of the SK hynix GDDR6 H56G32CS die with a memory capacity of 8 Gb and a D1y generation node.