Processor companies are packing more neural processing capability into processors for IoT edge devices. Here’s a look back at several of these that we covered in May.
Meta’s Reality Labs discussed a prototype AR processor at the 2024 ISSCC, fabricated using hybrid bonding as 3D packaging. This improved performance for the trial tasks of hand tracking and image processing.
Discover the latest advancements in DRAM technology as of Q2 2024, including updates on EUV lithography, HKMG processes, and emerging 3D DRAM developments from industry leaders like Samsung, SK hynix, and Micron.
Discover the latest advancements in 3D NAND technology with our Q2 2024 Memory Technology Roadmap update. Learn about Samsung, KIOXIA, Micron, SK hynix, and YMTC's newest innovations and upcoming products.
Discover the latest in AI and tech with Chip Observer May 2024. Highlights include NVIDIA's Blackwell chip, Intel's Gaudi 3, Apple's M4, new AI tools, and significant geopolitical and funding updates.
In this briefing, we capture market headlines from the previous months, including acquisitions and investments, major supply chain agreements, collaboration agreements, facility and capability expansions, and updates on the new and on-going patent litigations between Infineon and Innoscience, as well as EPC and Innoscience, respectively.
Complete with links to relevant Wi-Fi/IoT device reports from the TechInsights Platform, this Analysts’ Briefing is the essential companion the subscribers to discover the challenges and advancements in today’s mobile wireless connectivity outside the cellular domain.
In all the discussions around China’s effort to gain leadership in semiconductors, the question of how Japan lost its position – with such a huge advantage – keeps coming up. In the end, there were six strategic causes behind the long-term failure of Japan’s semiconductor industry.
Gain insights into China's semiconductor industry with TechInsights, foreseeing a 40% capacity growth over five years, driven by equipment purchases and strategic investments, shaping global markets and trade policies.
Explore HiSilicon's Hi1105-GFCV100 module and its manufacturing journey between TSMC and HLMC foundries, highlighting the design consistency and adaptability in the semiconductor industry amidst global chip shortages.
Consumer electronics often grapple with battery pack swelling in lithium-ion batteries, attributed to factors like rapid charging, inadequate thermal regulation, and prolonged full charge states. This study compares swelling control mechanisms in MacBook Pro M3 and Lenovo ThinkPad X1 Carbon Gen 11.
Synaptics’ new Astra platform aims to ease the integration of more AI compute capability in IoT edge devices with Arm-based SoCs featuring AI acceleration engines and an ecosystem of supporting software and development tools.
Chiplets: a disruptive business model? It’s important to ask this question when chiplets are only a new technology. Loss of leadership by incumbents becomes unavoidable whenever a new technology metastasizes into a new business model.
