TechInsights for Connected Computing

Battery Cell Essentials

TechInsights' Battery Cell Essentials profiles the innovations impacting battery life extension, energy density, safety, cost reduction, charging speed, etc. The analysis includes materials and structural analysis (anode, cathode, electrolyte, and separator) of innovative lithium-ion battery cells found in phones, wearables, laptops, tablets, pens, and more. The analysis will also show details of the battery pack, its fit in the source device, and the components found on the battery protection control module.

Battery Characterization

TechInsights' Battery Characterization covers cells from a range of market applications, with a focus on mobile and smaller (wearables, pens, etc.) form-factors from leading OEMs. The analysis provides insight into the thermal characteristics of devices during wireless and wired charging as well as lithium-ion battery performance during operation over a range of different conditions.

The Chip Insider® (CMRS TCI)

The Chip Insider® is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner. 

TCI Graphics

TechInsights' TCI Graphics content provides a unique view into the health of the semiconductors manufacturing ecosystem, including key performance indicators across electronics, semiconductors, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.

The McClean Report

The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

Connected Computing Devices

TechInsights’ Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.

Connected Home Devices

TechInsights’ Connected Home Devices gives you instant access to our extensive supply-side research and analysis of the latest trends impacting the global consumer electronics market. Served through the TechInsights Platform, you can view our current and historical forecasts and market trackers, read our expert commentary, and understand the competitive landscape across a range of product categories including Flat Panel TVs, Game Consoles, Wireless Speakers, Soundbars, Set-Top Boxes, Streaming Media Players and eBook readers.

Connected TV Strategies

Connected TV Strategies is designed to help players across the CTV ecosystem from device vendors to content owners and service providers navigate the transition from legacy TV to streaming TV. CTVS combines detailed quarterly vendor and OS share tracking of connected TV devices with deep insights into the key trends shaping the market and the implications for content owners. CTVS offers customers an objective, research-driven approach to addressing the central strategic questions facing the CTV hardware, media and entertainment industries today.

Smart Home Strategies

TechInsights’ Smart Home Strategies tracks devices and focuses on emerging opportunities in home monitoring, energy management, and home control systems and services. After many years of market exploration and trials, digital and IP technologies are finally enabling the widespread commercial service deployments which allow consumers to control and interact with their home security, energy and management systems. Smart Home Strategies builds on TechInsights’ 40-year heritage in exploring emerging home technology, application and service opportunities and identifies the key factors for success in this next stage in the digital home’s evolution.

Wearable Device Ecosystem

TechInsights’ Wearable Device Ecosystem gives you timely, super-detailed tracking of wearable device shipments and market share on a global, regional, and country basis for top-selling vendors such as Apple Watch or Xiaomi Mi Buds. It also delivers a deep dive into the high-growth wearables market. WDE tracks and forecasts wearables markets by size, market share, and price.

Wireless Smartphone Strategies

TechInsights’ Wireless Smartphone Strategies provides comprehensive coverage of the smartphone industry. WSS is a global handset and smartphone tracker by volume, value with price-tier, and value share / profitability as key differentiators. Granular OEM forecasts for the next 4 quarters and country-level smartphone forecast data for the next 5 years are provided.

Gaming Teardown

TechInsights' Gaming Teardown is the world's largest teardown library, housing an impressive collection of devices analyzed per year. Our industry-agnostic approach provides unbiased analysis to empower fact-based decision-making. Delve into the design philosophies and discover the design wins behind these innovative creations. With over 30+ teardowns conducted annually, our expertise has been relied upon by leading OEMs, semiconductor manufacturers, and component companies for more than 25 years. 

IoT Teardowns

With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.

Mobile Teardowns

TechInsights' Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.

Notebooks and Tablets Teardown

TechInsights' Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.

Smart Home Teardown

TechInsights' Smart Home Teardown provides analyses on an assortment of products ranging from operator deployed Set-Top-Boxes and OEM media streaming devices to smart speakers, Wi-Fi routers, and surveillance cameras. Get insights on costing trends and design techniques across the smart home ecosystem. Sample manufacturers include: Amazon, Google, Roku, Apple, Samsung, Sony.

SSD Teardown

TechInsights' SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.

Wearables Teardown

TechInsights' Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.

Circuit Analysis

TechInsights' Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.

Device Essentials

TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

Image Signal Processor

TechInsights' Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

Transceiver Architecture

TechInsights' IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.

Transceiver Floorplan

TechInsights' IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

AI Processor Service

AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.

Advanced CMOS Essentials

Advanced CMOS Essentials focuses on leading-edge SoCs and the technology used to manufacture them through structural and materials analysis. It identifies differences or nuances between competing technologies and differences between process technology options from the same company. Process Analytics offers aggregated process data, helping you create visualizations and trends of company, product, and technology evolution.

Digital Floorplan

TechInsights' Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

Packaging

TechInsights' Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

Process Flow Analysis

TechInsights' Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

SoC Design Analytics

TechInsights' SoC Design Analysis concentrates on high-volume, first-to-market SoCs from top fabless and foundry partnerships, and offers standard cell circuit extraction and layout analysis on key areas of cutting-edge SoCs. It gives insights on area and routing trade-offs and informs future design library choices. TechInsights' SoC Design analytics enable querying data, trend analysis, comparisons, and visualizations within Logic.

Transistor Architecture Comparison

TechInsights' Transistor Architecture Comparison coverage provides insight into the front end of line (FEOL) innovation that drives the world's most advanced technology solutions and how industry leaders deployed them (TSMC, Samsung, Intel) over the last three generations.

Transistor Characterization

TechInsights' Transistor Characterization assists in seeing the complete picture of process technologies and DC performance (Transistor Characterization). Understand the process, see the benchmark, and spot the trends. Transistor Characterization and Process Analytics assists you in conducting trend and predictive analysis of process data and its impact on transistor characterization (DC) performance through customized visualizations.

Acoustic Wave Filter​

Provides more insight into filter design strategies and their integration in RF front end (RFFE) SiPs to support evolving 5G demands and requirements. This content includes structural, materials, and topographical analyses of acoustic filters from highly integrated 5G RF Front End Modules and System-in-Packages (SiPs).

Front End Die Circuit​

Reveals how leading manufacturers are addressing space and power challenges in RF power amplifiers (PAs), low noise amplifiers (LNAs) and RF switches found on current RF Front End Modules. Extends the analysis from the Front End Module Architecture content to reveal more detailed insight at the circuit level.

Front End Module Architecture​

Provides more insight on how leading manufacturers are shifting away from discrete components to more space efficient solutions like power amplifier modules (PAM) and transceiver antenna modules. Shows interconnectivity of the die, filters and components from highly integrated RF Front End Modules (FEMs) found on cutting-edge designs from the latest 5G handsets.

Front End Power Management Floorplan

Focuses on power supply management, which is a key design challenge for RF Front End systems within market leading 5G handsets. Provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for envelope/average power trackers and FR2 PMICs from recent 5G smartphone platforms and wearables.

Mobile RF Architecture​

Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship 5G handsets in the industry for an in-depth understanding of RF front end design. There is no black boxing, and the reports include all passives in the system, antenna tuners, filters, FEM high-level layout, pin ins/pin outs, circuit board delayering, and cross-probing between the schematic and the layout of the physical printed circuit board (PCB).

RFIC Packaging​

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

RFIC Process

TechInsights' RFIC Process provides structural and materials analysis of transceivers and front end modules from the latest 5G handsets to reveal die structures and materials used during the manufacturing process. It includes topographical imaging and SEM/TEM cross-sectional with EDS/EELS materials analysis of the die structure.

Transceiver Architecture​

TechInsights' Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.

Transceiver Floorplan

TechInsights' Transceiver Floorplan provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for leading-edge 5G and FR2 transceivers in flagship handsets across market leaders and disruptors.

Power Essentials (Process – GaN, SiC, Si)

TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

Silicon Carbide Process Flow​

TechInsights' Silicon Carbide Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.