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NVIDIA is at the forefront of AI, computing, and advanced semiconductor design. TechInsights helps your teams stay ahead with exclusive access to deep technical analysis and market intelligence—all in one platform.
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Advanced Packaging
Stay on top of next-gen packaging innovations including hybrid bonding, chiplet architectures, 2.5D/3D integration, and substrate advances. Analyze packaging strategies shaping the future of high-performance computing, AI, and custom silicon.Digital Floorplan Analysis
Explore core layouts, architectural trends, and design efficiencies in top-tier processors and AI accelerators - giving your teams competitive design insight.Microprocessor Report
Weekly coverage of SoCs and microprocessors, focused on performance metrics, applications, and competitive positioning. A must-read for product strategists and system architects.Smartphone Compute Design Wins
Track key design wins and silicon selections in smartphones, enabling competitive benchmarking and ecosystem visibility.
Unlock Even More Insights With Add-On Solutions
These add-on packages give your teams powerful tools to estimate costs, benchmark designs, and accelerate product and technology strategy.
High-Performance Computing (HPC) Insights
The evolution of high-performance computing (HPC) is driving breakthroughs in AI, scientific research, and beyond. Success depends on optimizing processor architectures, interconnect density, and packaging strategies. TechInsights delivers the competitive intelligence you need to accelerate development, align investments with market trends, and manage costs and risks.
- Technical analysis of the latest CPUs and GPUs reveals technology process generation, structural trends and material choices driving performance.
- Interconnect scaling analyses show how advanced packaging and chiplet architectures enable parallel processing at greater efficiency.
- Detailed floorplan breakdowns of HPC devices allow providers to benchmark designs and optimize power, performance, and area tradeoffs.
- Competitive breakdown of high-bandwidth memory (HBM).
Semiconductor Manufacturing Economics
TechInsights' Semiconductor Manufacturing Economics (SME) Cost and Price Models and Fab Databases provide in-depth analysis of global wafer fabrication capacities, technologies, and trends. Simulate manufacturing costs, assess supplier expenses, and negotiate better prices with detailed "bottom-up" cost modeling. Gain a competitive edge by understanding the cost structures of semiconductor manufacturing, from wafer fabrication to die assembly and test.
- Designers of Semiconductor Products: Know the internal costs of fab lines before SoC design tape-out, and target “sweet spot” nodes for different functional blocks in a SIP.
- Fab and Sourcing Managers: Compare the competition from an internal cost perspective per year, wafer, reticle, and square centimeters. The combined models include over 1200 preset process flows which can be fine-tuned for specific simulations.
- Market and Strategy Analysts: Quantify capacity and technology trends by company, technology, and region.
Intel Gaudi3 AI Accelerator High Performance Interconnect and Packaging Analysis
Gaudi 3 pushes high-performance compute to new heights with advanced packaging built for demanding AI workloads. This HPY report breaks down the structural innovations, material choices, and architectural strategies behind its power, efficiency, and thermal performance—key intel as AI systems scale in complexity.
Unlocking AI Performance with Samsung HBM3
Samsung’s latest HBM3 innovation pushes memory performance to new levels for AI and high-performance computing. With a 12-high DRAM stack, advanced TSV and micro-bump interconnects, and exceptional bandwidth efficiency, this analysis highlights the packaging breakthroughs driving faster, smarter, and more scalable AI.
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With 30+ years of teardown and market expertise, TechInsights delivers the technical and strategic intelligence to help NVIDIA teams make faster, smarter decisions.
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