Search to Access Free In-Depth Analysis, Teardowns, and Reports.
Huawei Mate 70 Pro+: Exploring the HiSilicon Kirin 9020 Processor
Dive deeper into the technology powering the Huawei Mate 70 Pro+. Explore our in-depth analysis of the HiSilicon Kirin 9020 package, die architecture, and process node identification.
TechInsights is the authoritative information platform for the semiconductor industry.
Discover the power and potential of the TechInsights Platform and see why our customers include the most successful technology companies. With the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry, customers rely on our analyses to make informed business, design, and product decisions faster and with greater confidence.
Use the search below to explore in-depth analysis, teardowns, and reports—all for free. Dive into exclusive insights you want and need.
Unveiling the A18 vs A18 Pro – Key Differences in Apple's Latest SoCs
Discover the key differences between the A18 and A18 Pro processors in the iPhone 16 series. Log in to TechInsights Platform for the full analysis and detailed insights.
Apple iPhone 16 Pro Max (A3295) Teardown
Uncover the titanium design, A18 Pro chip, 6.9" OLED display, and 48MP camera.
Discover design changes, new camera controls, and the A18 processor.
Insights to stay ahead of the competition
1.5m+
reports
100,000+
chips torn down
110,000+
platform users
650+
companies served
30+
years of experience
Invaluable insight from industry-recognized SMEs
Leverage 25+ years of expertise to reveal technology innovations that impact your organization.
Our insights have been featured in
TechInsights’ Analysis of AMD’s MI300X Reveals Samsung HBM3
TechInsights reveals the first commercial use of Samsung's HBM3 memory in AMD’s MI300X AI accelerator. Discover how this breakthrough impacts AI processors, memory technology, and advanced packaging.
Innovations in Logic Scaling Performance for Semiconductors
Explore cutting-edge innovations in logic scaling performance. Discover nanosheets, CFETs, and next-gen materials shaping the future of semiconductors.
CES 2025: HL Klemove & Harman Unveil Integrated Automotive Platform
Explore how HL Klemove and Harman's partnership, unveiled at CES 2025, is driving the shift to centralized automotive architectures by integrating cockpit and ADAS technologies.
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
