Vivo V3 Standalone Image Signal Processor Standard Floorplan Analysis

A Standard Floorplan Analysis (FAR) of the Vivo V3 standalone image signal processor (ISP) die extracted from the Vivo X100 Ultra (V2366GA) smartphone. The V3 package measures 6.61 mm × 5.68 mm × 0.72 mm thick. The ISP die is fabricated using eleven copper (Cu) metal interconnect layers, one aluminum (Al) layer tungsten (W) contacts, high-k metal gates (HKMG), FinFET transistors, and shallow trench isolation (STI).