Xiaomi Redmi 13 (2404ARN45A) LTE Survey Plus Teardown

Xiaomi Redmi 13 (2404ARN45A) LTE Survey Plus Teardown

Explore the Xiaomi Redmi 13 LTE teardown: Dive into detailed analysis, major ICs, RF modules, component functions, and price estimates in our comprehensive Survey Plus Report.

Survey Plus Reports (SPT) include: device observations, analysis summary, major IC manufacturer distribution, RF block diagrams, main enclosure material information, identify primary ICs and RF modules such as SAW filters and duplexers, ICs and RF modules categorized by component functions, provide package and die-size parameters, selected die photos, information on major sub-assemblies such as cameras and display/touchscreen subsystems, price estimates for the ICs and RF modules.

View the Analysis

This summary outlines the analysis found on the TechInsights' Platform.

Enter your email to register to the TechInsights Platform and access the full analysis summary, as well as the report.

Already a TechInsights Platform User?

View the Analysis

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.